Long-term effects Neuroplasticity. Neuroplasticity is the process by which neurons adapt to a disturbance over time, and most often occurs in response to repeated exposure to stimuli. Aerobic exercise increases the production of neurotrophic factors (e.g., BDNF, IGF-1, VEGF) which mediate improvements in cognitive functions and various forms of memory by promoting blood vessel formation in the. Lingon x 6 6 1. 8GB Kit (4x2GB) DDR2 800 Udimm RAM, ROYEMAI DDR2-800 mhz PC2-6400 /PC2-6400U DDR2 2GB 1.8V CL6 240 Pin Non-ECC Unbuffered Desktop RAM Memory Modules 4.7 out of 5 stars 14 $29.99 $ 29. 8GB Kit (4x2GB) DDR2 800 Udimm RAM, ROYEMAI DDR2-800 mhz PC2-6400 /PC2-6400U DDR2 2GB 1.8V CL6 240 Pin Non-ECC Unbuffered Desktop RAM Memory Modules 4.7 out of 5 stars 14 $29.99 $ 29.
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2.1. WHAT MEMORY LOOKS LIKE
Memory comes in a variety of sizes and shapes. In general, itlooks like a flat green stick with little black cubes on it.Obviously, there’s a lot more to memory than that. The illustrationbelow shows a typical memory module and points out some of its mostimportant features.
PCB(PRINTED CIRCUIT BOARD)
The green board that all the memory chips sit on is actually madeup of several layers. Each layer contains traces and circuitry,which facilitate the movement of data. In general, higher qualitymemory modules use PCBs with more layers. The more layers a PCBhas, the more space there is between traces. The more space thereis between traces, the lesser the chance of noise interference.This makes the module much more reliable.DRAM (DYNAMIC RANDOM ACCESS MEMORY)
DRAM is the most common form of RAM. It’s called “dynamic” RAMbecause it can only hold data for a short period of time and mustbe refreshed periodically. Most memory chips have black or chromecoating, or packaging, to protect their circuitry. The followingsection titled “Chip Packaging” shows pictures of chips housed indifferent types of chip packages.CONTACT FINGERS
The contact fingers, sometimes referred to as “connectors” or“leads,” plug into the memory socket on the system board, enablinginformation to travel from the system board to the memory moduleand back. On some memory modules, these leads are plated with tinwhile on others, the leads are made of gold. To learn more aboutthe type of metal on the contacts, refer to the section titled,“Tin versus Gold” on page 67.INTERNAL TRACE LAYER
The magnifying glass shows a layer of the PCB stripped away toreveal the traces etched in the board. Traces are like roads thedata travels on. The width and curvature of these traces as well asthe distance between them affect both the speed and the reliabilityof the overall module. Experienced designers arrange, or “lay out,”the traces to maximize speed and reliability and minimizeinterference.CHIP PACKAGING
The term “chip packaging” refers to the material coating around theactual silicon. Today’s most common packaging is called TSOP (ThinSmall Outline Package). Some earlier chip designs used DIP (DualIn-line Package) packaging and SOJ (Small Outline J-lead). Newerchips, such as RDRAM use CSP (Chip Scale Package). Take a look atthe different chip packages below, so you can see how they differ.DIP (DUAL IN-LINE PACKAGE)
When it was common for memory to be installed directly on thecomputer’s system board, the DIP-style DRAM package was extremelypopular. DIPs are through-hole components, which means they installin holes extending into the surface of the PCB. They can besoldered in place or installed in sockets.SOJ (SMALL OUTLINE J-LEAD)
SOJ packages got their name because the pins coming out of the chipare shaped like the letter “J”. SOJs are surface-mount components -that is, they mount directly onto the surface of the PCB.TSOP (THIN SMALL OUTLINE PACKAGE)
TSOP packaging, another surface-mount design, got its name becausethe package was much thinner than the SOJ design. TSOPs were firstused to make thin credit card modules for notebook computers.CSP (CHIP SCALE PACKAGE)
Unlike DIP, SOJ, and TSOP packaging, CSP packaging doesn’t use pinsto connect the chip to the board. Instead, electrical connectionsto the board are through a BGA (Ball Grid Array) on the undersideof the package. RDRAM (Rambus DRAM) chips utilize this type ofpackaging.CHIP STACKING
For some higher capacity modules, it is necessary to stack chips ontop of one another to fit them all on the PCB. Chips can be“stacked” either internally or externally. “Externally” stackedchip arrangements are visible, whereas “internally” stacked chiparrangements are not.Purrfect Memory 1 02 01
Purrfect Memory 1 02 Full
Example of externally stacked chips.